Reliability and failure analysis of high-power led packaging.
Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliabilit...
Call Number: | Libro Electrónico |
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Main Author: | Tan, Cher Ming |
Other Authors: | Singh, Preetpal |
Format: | Electronic eBook |
Language: | Inglés |
Published: |
Cambridge, MA :
Woodhead Publishing Limited,
2022.
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Series: | Woodhead Publishing series in electronic and optical materials
|
Subjects: | |
Online Access: | Texto completo |
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