Cita APA (7a ed.)

Tan, C. M., & Singh, P. (2022). Reliability and failure analysis of high-power led packaging. Woodhead Publishing Limited.

Cita Chicago Style (17a ed.)

Tan, Cher Ming, y Preetpal Singh. Reliability and Failure Analysis of High-power Led Packaging. Cambridge, MA: Woodhead Publishing Limited, 2022.

Cita MLA (8a ed.)

Tan, Cher Ming, y Preetpal Singh. Reliability and Failure Analysis of High-power Led Packaging. Woodhead Publishing Limited, 2022.