Tan, C. M., & Singh, P. (2022). Reliability and failure analysis of high-power led packaging. Woodhead Publishing Limited.
Chicago Style (17th ed.) CitationTan, Cher Ming, and Preetpal Singh. Reliability and Failure Analysis of High-power Led Packaging. Cambridge, MA: Woodhead Publishing Limited, 2022.
MLA (8th ed.) CitationTan, Cher Ming, and Preetpal Singh. Reliability and Failure Analysis of High-power Led Packaging. Woodhead Publishing Limited, 2022.
Warning: These citations may not always be 100% accurate.