Style de citation APA (7e éd.)

Ma, S., & Jin, Y. (2022). TSV 3D RF integration: High resistivity Si interposer technology. Elsevier.

Style de citation Chicago (17e éd.)

Ma, Shenglin, et Yufeng Jin. TSV 3D RF Integration: High Resistivity Si Interposer Technology. Amsterdam, Netherlands: Elsevier, 2022.

Style de citation MLA (8e éd.)

Ma, Shenglin, et Yufeng Jin. TSV 3D RF Integration: High Resistivity Si Interposer Technology. Elsevier, 2022.