APA (7th ed.) Citation

Ma, S., & Jin, Y. (2022). TSV 3D RF integration: High resistivity Si interposer technology. Elsevier.

Chicago Style (17th ed.) Citation

Ma, Shenglin, and Yufeng Jin. TSV 3D RF Integration: High Resistivity Si Interposer Technology. Amsterdam, Netherlands: Elsevier, 2022.

MLA (8th ed.) Citation

Ma, Shenglin, and Yufeng Jin. TSV 3D RF Integration: High Resistivity Si Interposer Technology. Elsevier, 2022.