Cita APA (7a ed.)

Ma, S., & Jin, Y. (2022). TSV 3D RF integration: High resistivity Si interposer technology. Elsevier.

Cita Chicago Style (17a ed.)

Ma, Shenglin, y Yufeng Jin. TSV 3D RF Integration: High Resistivity Si Interposer Technology. Amsterdam, Netherlands: Elsevier, 2022.

Cita MLA (8a ed.)

Ma, Shenglin, y Yufeng Jin. TSV 3D RF Integration: High Resistivity Si Interposer Technology. Elsevier, 2022.