Advances in chemical mechanical planarization (CMP) /
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planar...
Call Number: | Libro Electrónico |
---|---|
Other Authors: | |
Format: | Electronic eBook |
Language: | Inglés |
Published: |
Duxford, United Kingsom :
Woodhead Publishing,
2022.
|
Edition: | Second edition. |
Series: | Woodhead Publishing series in electronic and optical materials.
|
Subjects: | |
Online Access: | Texto completo |