|
|
|
|
| LEADER |
00000cam a2200000 i 4500 |
| 001 |
SCIDIR_on1143639151 |
| 003 |
OCoLC |
| 005 |
20231120010440.0 |
| 006 |
m o d |
| 007 |
cr cnu---unuuu |
| 008 |
200314s2020 enk o 000 0 eng d |
| 040 |
|
|
|a EBLCP
|b eng
|e rda
|e pn
|c EBLCP
|d OPELS
|d UKAHL
|d YDXIT
|d OCLCQ
|d AU@
|d YDX
|d OCLCQ
|d OCLCF
|d OCLCQ
|d COM
|d OCLCO
|d OCLCQ
|d OCLCO
|
| 019 |
|
|
|a 1148476923
|
| 020 |
|
|
|a 9780081019566
|q (electronic book)
|
| 020 |
|
|
|a 0081019564
|q (electronic book)
|
| 020 |
|
|
|a 9780081019559
|q (electronic book)
|
| 020 |
|
|
|a 0081019556
|q (electronic book)
|
| 020 |
|
|
|z 9781785481901
|
| 035 |
|
|
|a (OCoLC)1143639151
|z (OCoLC)1148476923
|
| 050 |
|
4 |
|a TJ163.12
|b .E63 2020
|
| 082 |
0 |
4 |
|a 006.2/2
|2 23
|
| 245 |
0 |
0 |
|a Embedded mechatronic systems.
|n 2,
|p Analyses of failures, modeling, simulation and optimization /
|c edited by Abdelkhalak El Hami, Philippe Pougnet.
|
| 246 |
3 |
0 |
|a Analyses of failures, modeling, simulation and optimization
|
| 250 |
|
|
|a Second edition.
|
| 264 |
|
1 |
|a London :
|b ISTE, Ltd. ;
|a Kidlington :
|b Elsevier,
|c 2020.
|
| 300 |
|
|
|a 1 online resource (300 pages)
|
| 336 |
|
|
|a text
|b txt
|2 rdacontent
|
| 337 |
|
|
|a computer
|b c
|2 rdamedia
|
| 338 |
|
|
|a online resource
|b cr
|2 rdacarrier
|
| 588 |
0 |
|
|a Print version record.
|
| 505 |
0 |
|
|a Front Cover -- Embedded Mechatronic Systems 2: Analyses of Failures, Modeling, Simulation and Optimization -- Copyright page -- Contents -- Preface -- 1. Highly Accelerated Testing -- 1.1. Introduction -- 1.2. Load characteristics of the Super HAT equipment -- 1.3. Description of the Super HAT system -- 1.4. Application -- 1.5. Conclusion -- 1.6. References -- 2. Aging Power Transistors in Operational Conditions -- 2.1. Introduction -- 2.2. Aging microwave power electronic components under operational conditions -- 2.3. Application to the study of microwave power transistors
|
| 505 |
8 |
|
|a 2.4. Conclusion -- 2.5. References -- 3. Physical Defects Analysis of Mechatronic Systems -- 3.1. Introduction -- 3.2. Equipment and methodology for analyzing failure inmechatronic systems -- 3.3. Analysis of physical defects -- 3.4. Conclusion -- 3.5. References -- 4. Impact of Voids in Interconnection Materials -- 4.1. Introduction -- 4.2. Thermal transfer and thermo-elasticity -- 4.3. Description of the numerical method -- 4.4. Simulation of thermal and thermomechanical effects in the interconnection material of an electronic module -- 4.5. Conclusion -- 4.6. References
|
| 505 |
8 |
|
|a 5. Electro-Thermo-Mechanical Modeling -- 5.1. Introduction -- 5.2. Theory of electro-thermo-mechanical coupling -- 5.3. Simulation of electro-thermo-mechanical behavior using the finite element method -- 5.4. Example of an electro-thermo-mechanical simulation of an HBT transistor -- 5.5. Modal analysis of mechanical components -- 5.6. Stochastic modal analysis of structures -- 5.7. Numerical identification of the elastic parameters of electronic components -- 5.8. Example of modeling and simulation of the vibratory behavior of mechatronic components -- 5.9. Conclusion
|
| 505 |
8 |
|
|a 5.10. List of abbreviations and symbols -- 5.11. References -- 6. Meta-Model Development -- 6.1. Introduction -- 6.2. Definition of a meta-model -- 6.3. Selection of factors: screening -- 6.4. Creation of designs of experiments -- 6.5. Modeling of the response surface: PLS regression and Kriging -- 6.6. Sensitivity analysis of the model: variance decomposition, Sobol criterion -- 6.7. Robust design -- 6.8. Conclusion -- 6.9. References -- 7. Probabilistic Study and Optimization of a Solder Interconnect -- 7.1. Introduction -- 7.2. Electronic equipment
|
| 505 |
8 |
|
|a 7.3. Thermal modeling of the electronic board -- 7.4. Probabilistic study of the effect of thermomechanical stresses on a solder joint -- 7.5. Optimization of the solder joint -- 7.6. Conclusion -- 7.7. References -- 8. High-Efficiency Architecture for Power Amplifiers -- 8.1. Introduction -- 8.2. Main reliability parameters -- 8.3. Methodology -- 8.4. Aging tests -- 8.5. Other results -- 8.6. Origin of degradations: discussion -- 8.7. Physical analysis -- 8.8. Amplifier design rules -- 8.9. Conclusion -- 8.10. References -- 9. Reliability Analysis based on Metamodels of Chip-Scale Packages (CSP)
|
| 500 |
|
|
|a 9.1. Introduction
|
| 588 |
0 |
|
|a Online resource; title from digital title page (viewed on April 06, 2020).
|
| 650 |
|
0 |
|a Embedded computer systems.
|
| 650 |
|
0 |
|a Mechatronics.
|
| 650 |
|
6 |
|a Syst�emes enfouis (Informatique)
|0 (CaQQLa)201-0171574
|
| 650 |
|
6 |
|a M�ecatronique.
|0 (CaQQLa)201-0247066
|
| 650 |
|
7 |
|a Embedded computer systems
|2 fast
|0 (OCoLC)fst00908298
|
| 650 |
|
7 |
|a Mechatronics
|2 fast
|0 (OCoLC)fst01013514
|
| 700 |
1 |
|
|a El Hami, Abdelkhalak,
|e editor.
|
| 700 |
1 |
|
|a Pougnet, Philippe,
|e editor.
|
| 776 |
0 |
8 |
|i Print version:
|a El Hami, Abdelkhalak.
|t Embedded Mechatronic Systems.
|d Saint Louis : Elsevier, �2020
|z 9781785481901
|
| 856 |
4 |
0 |
|u https://sciencedirect.uam.elogim.com/science/book/9781785481901
|z Texto completo
|
