Modeling, analysis, design, and tests for electronics packaging beyond Moore /

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Bibliographic Details
Call Number:Libro Electrónico
Main Authors: Zhang, Hengyun (Author), Che, Faxing (Author), Lin, Tingyu (Author), Zhao, Wensheng (Author)
Format: Electronic eBook
Language:Inglés
Published: Duxford, United Kingdom : Woodhead Publishing, an imprint of Elsevier, [2020]
Series:Woodhead Publishing series in electronic and optical materials.
Series on advanced electronic packaging technology and key materials.
Subjects:
Electronic apparatus and appliances > Packaging.
Appareils �electroniques > Emballage.
Online Access:Texto completo
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Modeling, analysis, design, and tests for electronics packaging beyond Moore /
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