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Modeling, analysis, design, and tests for electronics packaging beyond Moore /
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , , , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Duxford, United Kingdom :
Woodhead Publishing, an imprint of Elsevier,
[2020]
|
| Colección: | Woodhead Publishing series in electronic and optical materials.
Series on advanced electronic packaging technology and key materials. |
| Temas: | |
| Acceso en línea: | Texto completo |
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