APA (7th ed.) Citation

Zhang, H., Che, F., Lin, T., & Zhao, W. (2020). Modeling, analysis, design, and tests for electronics packaging beyond Moore. Woodhead Publishing, an imprint of Elsevier.

Chicago Style (17th ed.) Citation

Zhang, Hengyun, Faxing Che, Tingyu Lin, and Wensheng Zhao. Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore. Duxford, United Kingdom: Woodhead Publishing, an imprint of Elsevier, 2020.

MLA (8th ed.) Citation

Zhang, Hengyun, et al. Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore. Woodhead Publishing, an imprint of Elsevier, 2020.