Cita APA (7a ed.)

Zhang, H., Che, F., Lin, T., & Zhao, W. (2020). Modeling, analysis, design, and tests for electronics packaging beyond Moore. Woodhead Publishing, an imprint of Elsevier.

Cita Chicago Style (17a ed.)

Zhang, Hengyun, Faxing Che, Tingyu Lin, y Wensheng Zhao. Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore. Duxford, United Kingdom: Woodhead Publishing, an imprint of Elsevier, 2020.

Cita MLA (8a ed.)

Zhang, Hengyun, et al. Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore. Woodhead Publishing, an imprint of Elsevier, 2020.