Advanced organics for electronic substrates and packages /

Advanced Organics for Electronic Substrates and Packages.

Detalles Bibliográficos
Clasificación:Libro Electrónico
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Oxford, England : Elsevier Advanced Technology, 1992.
Edición:First edition.
Temas:
Electronic packaging > Materials.
Mise sous bo�itier (�Electronique) > Mat�eriaux.
TECHNOLOGY & ENGINEERING > Mechanical.
Electronic packaging > Materials
Acceso en línea:Texto completo

MARC

LEADER 00000cam a2200000Mi 4500
001 SCIDIR_ocn896845892
003 OCoLC
005 20231120111635.0
006 m o d
007 cr cn|||||||||
008 141111t19921992enk o 000 0 eng d
040 |a E7B  |b eng  |e rda  |e pn  |c E7B  |d OCLCO  |d N$T  |d OCLCF  |d YDXCP  |d EBLCP  |d DEBSZ  |d OCLCQ  |d MERUC  |d OCLCQ  |d OPELS  |d UKAHL  |d OCLCQ  |d OCLCO  |d OCLCQ  |d OCLCO 
019 |a 881849271  |a 902956921 
020 |a 9781483165615  |q (electronic bk.) 
020 |a 1483165612  |q (electronic bk.) 
020 |a 1483133192 
020 |a 9781483133195 
020 |z 9781483133195 
020 |z 1856171558 
020 |z 9781856171557 
035 |a (OCoLC)896845892  |z (OCoLC)881849271  |z (OCoLC)902956921 
050 4 |a TK7870.15  |b .A33 1992eb 
072 7 |a TEC  |x 009070  |2 bisacsh 
082 0 4 |a 621.381/046  |2 20 
245 0 0 |a Advanced organics for electronic substrates and packages /  |c research manager, Andrew E. Fletcher. 
250 |a First edition. 
264 1 |a Oxford, England :  |b Elsevier Advanced Technology,  |c 1992. 
264 4 |c �1992 
300 |a 1 online resource (231 pages) 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
588 0 |a Print version record. 
505 0 |a Front Cover; Advanced Organics for Electronic Substrates and Packages; Copyright Page; Table of Contents; EXECUTIVE SUMMARY AND CONCLUSIONS; CHAPTER 1. INTRODUCTION; 1.1 History and Developments in Electronic Devices; 1.2 Packaging Developments; 1.3 Conclusions; 1.4 Future Developments; 1.5 Development Projects and Initiatives; 1.6 Quality assurance; 1.7 Standards; 1.8 Environment; CHAPTER 2. MARKETS; CHAPTER 3. PRODUCTION; 3.1 Integrated Circuits (ICs); 3.2 Printed Circuit Boards (PCBs); 3.3 Encapsulation; 3.4 Packaging; CHAPTER 4. APPLICATIONS; 4.1 History and Background; 4.2 Packaging. 
505 8 |a 4.3 Polymers in Chip Fabrication (Level 0)4.4 Level 1 Packaging; 4.5 Package Types; 4.6 Multichip Module Packaging; 4.7 Thin Film Packaging; 4.8 Polymer Thick Film; 4.9 Level 2 Packaging; CHAPTER 5. MATERIALS; 5.1 Materials for Packages; 5.2 Thermoplastic and Thermoset Materials; 5.3 Interpenetrating Polymer Networks; 5.4 Material Properties and Requirements; 5.5 Thin Films; 5.6 Protective Gels; 5.7 Rigid Encapsulants; 5.8 PCB Laminates; 5.9 Materials Applications; 5.10 Environmental Considerations; 5.11 Properties of some Organic Packaging Materials; CHAPTER 6. THERMOSET POLYMERS. 
505 8 |a 6.1 Epoxies6.3 Methods of Production; 6.4 Resins; 6.5 Phenolic Resins; CHAPTER 7. THERMOPLASTIC COMPOUNDS; 7.1 Markets; 7.2 Material Properties; 7.3 Polyimides; 7.4 Polyurethanes; 7.5 Polyethers; 7.6 Polyesters; 7.7 Liquid Crystal Polymers; 7.8 Organosilicon Polymers; 7.9 Fluoropolymers; 7.10 Poly-(para-xylene); 7.11 Conductive Polymers; CHAPTER 8. SILICONES; CHAPTER 9. ACTIVITIES BY COMPANIES AND ORGANISATIONS; 9.1 North America; 9.2 Europe; 9.3 Japan; 9.4 Rest of the World. 
520 |a Advanced Organics for Electronic Substrates and Packages. 
650 0 |a Electronic packaging  |x Materials. 
650 6 |a Mise sous bo�itier (�Electronique)  |0 (CaQQLa)201-0074280  |x Mat�eriaux.  |0 (CaQQLa)201-0379329 
650 7 |a TECHNOLOGY & ENGINEERING  |x Mechanical.  |2 bisacsh 
650 7 |a Electronic packaging  |x Materials  |2 fast  |0 (OCoLC)fst00907419 
700 1 |a Fletcher, Andrew E.,  |e consultant. 
776 0 8 |i Print version:  |t Advanced organics for electronic substrates and packages.  |b First edition.  |d Oxford, England : Elsevier Advanced Technology, �1992  |h 230 pages  |z 9781483133195 
856 4 0 |u https://sciencedirect.uam.elogim.com/science/book/9781483133195  |z Texto completo 

Ejemplares similares