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SCIDIR_ocn769153733 |
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OCoLC |
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20231117044648.0 |
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m o d |
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111222s2012 enka o 001 0 eng d |
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|a HKP
|b eng
|e pn
|c HKP
|d HKP
|d OPELS
|d TEF
|d B24X7
|d OCLCQ
|d CDX
|d OCLCF
|d ZCU
|d YDXCP
|d OCLCQ
|d UIU
|d OCLCQ
|d STF
|d OCLCQ
|d U3W
|d COO
|d CNNAI
|d WYU
|d LEAUB
|d OL$
|d OCLCO
|d OCLCQ
|d OCLCO
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019 |
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|a 858453460
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|a 9781437778595
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|a 1437778593
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035 |
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|a (OCoLC)769153733
|z (OCoLC)858453460
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050 |
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4 |
|a TS670
|b .A386 2012eb
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0 |
4 |
|a 671.7/2
|2 23
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0 |
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|a Advances in CMP/polishing technologies for the manufacture of electronic devices /
|c edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.
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250 |
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|a 1st ed.
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260 |
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|a Oxford :
|b William Andrew,
|c 2012.
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300 |
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|a 1 online resource (xii, 317 pages)
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336 |
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|a text
|b txt
|2 rdacontent
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337 |
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|a computer
|b c
|2 rdamedia
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338 |
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|a online resource
|b cr
|2 rdacarrier
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520 |
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|a CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R & D accessible to the wider engineering community.
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500 |
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|a Includes index.
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650 |
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0 |
|a Electrolytic polishing.
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650 |
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0 |
|a Grinding and polishing.
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650 |
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6 |
|a Polissage �electrolytique.
|0 (CaQQLa)201-0077168
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650 |
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7 |
|a electropolishing.
|2 aat
|0 (CStmoGRI)aat300053872
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650 |
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7 |
|a Electrolytic polishing
|2 fast
|0 (OCoLC)fst00906510
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650 |
|
7 |
|a Grinding and polishing
|2 fast
|0 (OCoLC)fst00947952
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700 |
1 |
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|a Doi, Toshiro.
|4 edt
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700 |
1 |
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|a Marinescu, Ioan D.
|4 edt
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700 |
1 |
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|a Kurokawa, Syuhei.
|4 edt
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856 |
4 |
0 |
|u https://sciencedirect.uam.elogim.com/science/book/9781437778595
|z Texto completo
|