Characterization of integrated circuit packaging materials /

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Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues ar...

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Bibliographic Details
Call Number:Libro Electrónico
Other Authors: Moore, Thomas M., McKenna, Robert G.
Format: Electronic eBook
Language:Inglés
Published: Boston : Butterworth-Heinemann, �1993.
Series:Materials characterization series.
Subjects:
Electronic packaging > Materials.
Integrated circuits > Design and construction.
Mise sous bo�itier (�Electronique) > Mat�eriaux.
Circuits int�egr�es > Conception et construction.
TECHNOLOGY & ENGINEERING > Mechanical.
Electronic packaging > Materials
Integrated circuits > Design and construction
Electronic equipment > Packaging
Online Access:Texto completo
Description
Summary:Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Physical Description:1 online resource (xviii, 274 pages) : illustrations
Bibliography:Includes bibliographical references and index.
ISBN:9781483292342
1483292347

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