Cita APA (7a ed.)

Moore, T. M., & McKenna, R. G. (1993). Characterization of integrated circuit packaging materials. Butterworth-Heinemann.

Cita Chicago Style (17a ed.)

Moore, Thomas M., y Robert G. McKenna. Characterization of Integrated Circuit Packaging Materials. Boston: Butterworth-Heinemann, 1993.

Cita MLA (8a ed.)

Moore, Thomas M., y Robert G. McKenna. Characterization of Integrated Circuit Packaging Materials. Butterworth-Heinemann, 1993.