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Hybrid microcircuit technology handbook : materials, processes, design, testing and production /

Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis...

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Bibliographic Details
Call Number:Libro Electrónico
Main Author: Licari, James J., 1930-
Other Authors: Enlow, Leonard R.
Format: eBook
Language:Inglés
Published: Westwood, N.J. : Noyes Publicatons, �1998.
Edition:2nd ed.
Series:Materials science and process technology series.
Subjects:
Online Access:Texto completo
Table of Contents:
  • Introduction
  • Substrates
  • Thin Film Processes
  • Thick Film Processes
  • Resistor Trimming
  • Parts Selection
  • Assembly Processes
  • Testing
  • Handling and Clean Rooms
  • Design Guidelines
  • Documentation and Specifications
  • Failure Analysis
  • Multichip Modules: A New Breed of Hybrid Microcircuits
  • References
  • Index.