Handbook of 3D integration. Volume 4, Design, test, and thermal management /

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Franzon, Paul D. (Editor ), Marinissen, Eric Jan (Editor ), Bakir, Muhannad S. (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Weinheim, Germany : Wiley-VCH, [2019]
Temas:
Three-dimensional integrated circuits > Design and construction > Handbooks, manuals, etc.
Three-dimensional imaging > Handbooks, manuals, etc.
Imagerie tridimensionnelle > Guides, manuels, etc.
TECHNOLOGY & ENGINEERING > Mechanical.
Three-dimensional imaging
Handbook
handbooks.
Handbooks and manuals
Handbooks and manuals.
Guides et manuels.
Acceso en línea:Texto completo (Requiere registro previo con correo institucional)

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Texto completo (Requiere registro previo con correo institucional)

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