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Wire bonding in microelectronics

Bibliographic Details
Call Number:	Libro Electrónico
Main Author:	Harman, George G.
Format:	Electronic eBook
Language:	Inglés
Published:	New York : McGraw-Hill, [2010]
Edition:	3rd ed.
Series:	McGraw-Hill's AccessEngineering.
Subjects:	Wire bonding (Electronic packaging) > Production control. Electronic packaging > Reliability. Electronic packaging > Defects. Semiconductors > Failures. Electronic books. Internet resources.
Online Access:	Texto completo

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