Wire bonding in microelectronics

Détails bibliographiques
Cote:Libro Electrónico
Auteur principal: Harman, George G.
Format: Électronique eBook
Langue:Inglés
Publié: New York : McGraw-Hill, [2010]
Édition:3rd ed.
Collection:McGraw-Hill's AccessEngineering.
Sujets:
Wire bonding (Electronic packaging) > Production control.
Electronic packaging > Reliability.
Electronic packaging > Defects.
Semiconductors > Failures.
Electronic books.
Internet resources.
Accès en ligne:Texto completo
Description
Description:Print version c2010.
Previous edition: 1997; first published as: Reliability and yield problems of wire bonding in microelectronics. 1989.
Description matérielle:1 electronic text (xx, 426 p.) : ill.
Also issued in print and PDF versions.
Bibliographie:Includes bibliographical references and index.
ISBN:9780071476232
9780071703345

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