Wire bonding in microelectronics
Call Number: | Libro Electrónico |
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Main Author: | |
Format: | Electronic eBook |
Language: | Inglés |
Published: |
New York :
McGraw-Hill,
[2010]
|
Edition: | 3rd ed. |
Series: | McGraw-Hill's AccessEngineering.
|
Subjects: | |
Online Access: | Texto completo |
Item Description: | Print version c2010. Previous edition: 1997; first published as: Reliability and yield problems of wire bonding in microelectronics. 1989. |
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Physical Description: | 1 electronic text (xx, 426 p.) : ill. Also issued in print and PDF versions. |
Bibliography: | Includes bibliographical references and index. |
ISBN: | 9780071476232 9780071703345 |