Electronic failure analysis handbook : techniques and applications for electronic and electrical packages, components, and assemblies /

"In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--Jacket.

Détails bibliographiques
Cote:Libro Electrónico
Auteur principal: Martin, Perry L. (Auteur)
Autres auteurs: Dylls, D. David, Medora, Noshirwan K., Le May, Ian, Ludwig, Lawrence L., Kaplan, Herbert, Kessler, L. W., Semmens, J. E., Roche, David J., Erickson, J. J., Devaney, John R., Van Westerhuyzen, Dennis H., Vettraino, L. G., Blanchard, Richard A., Galler, Donald, Glover, Duncan, Kusko, Alexander, Loud, John D., Mimmack, Gregory J., Slenski, George, Denson, William, Muller, Gunter, Dunbar, William G.
Format: Électronique eBook
Langue:Inglés
Publié: New York, N.Y. : McGraw-Hill Education, [2000]
Édition:First edition.
Collection:McGraw-Hill's AccessEngineering.
Sujets:
Electronic apparatus and appliances > Reliability.
System failures (Engineering)
Microelectronics.
Semiconductors.
Acoustic imaging.
Infrared photography.
Electron microscopy.
X-ray microscopy.
Metallography.
Semiconductors > Defects.
Solder and soldering.
Printed circuits.
Electronic apparatus and appliances > Defects.
Electronics > Materials > Defects.
Electronic books.
Accès en ligne:Texto completo

Internet

Texto completo

Items no disponibles

Informations d'exemplaires de

Documents similaires