Microvias : for low-cost, high-density interconnects /

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Détails bibliographiques
Cote:Libro Electrónico
Auteur principal: Lau, John H. (Auteur)
Autres auteurs: Lee, S. W. Ricky
Format: Électronique eBook
Langue:Inglés
Publié: New York, N.Y. : McGraw-Hill Education, [2001]
Édition:First edition.
Collection:McGraw-Hill's AccessEngineering.
Sujets:
Microelectronic packaging.
Multichip modules (Microelectronics)
Flip chip technology.
Printed circuits.
Drilling and boring.
Micro-drilling.
Microelectronics > Materials.
Solder and soldering.
Solder and soldering > Testing.
Microelectronics packaging > Reliability.
Multichip modules (Microelectronics) > Testing.
Integrated circuits > Design and construction > Cost control.
Semiconductors > Junctions.
Electronic books.
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