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Microvias : for low-cost, high-density interconnects /
Annotation.
| Call Number: | Libro Electrónico |
|---|---|
| Main Author: | |
| Other Authors: | |
| Format: | Electronic eBook |
| Language: | Inglés |
| Published: |
New York, N.Y. :
McGraw-Hill Education,
[2001]
|
| Edition: | First edition. |
| Series: | McGraw-Hill's AccessEngineering.
|
| Subjects: | |
| Online Access: | Texto completo |