Microvias : for low-cost, high-density interconnects /

Annotation.

Bibliographic Details
Call Number:Libro Electrónico
Main Author: Lau, John H. (Author)
Other Authors: Lee, S. W. Ricky
Format: Electronic eBook
Language:Inglés
Published: New York, N.Y. : McGraw-Hill Education, [2001]
Edition:First edition.
Series:McGraw-Hill's AccessEngineering.
Subjects:
Microelectronic packaging.
Multichip modules (Microelectronics)
Flip chip technology.
Printed circuits.
Drilling and boring.
Micro-drilling.
Microelectronics > Materials.
Solder and soldering.
Solder and soldering > Testing.
Microelectronics packaging > Reliability.
Multichip modules (Microelectronics) > Testing.
Integrated circuits > Design and construction > Cost control.
Semiconductors > Junctions.
Electronic books.
Online Access:Texto completo
Description
Summary:Annotation.
Item Description:Print version c2001.
Physical Description:1 online resource (xxiii, 565 pages) : illustrations.
Also available in print edition.
Bibliography:Includes bibliographical references and index.
ISBN:0071455795
0071363270 (print-ISBN)
9780071363273

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