Cita APA (7a ed.)

Lau, J. H., & Lee, S. W. R. (2001). Microvias: For low-cost, high-density interconnects (First edition.). McGraw-Hill Education.

Cita Chicago Style (17a ed.)

Lau, John H., y S. W. Ricky Lee. Microvias: For Low-cost, High-density Interconnects. First edition. New York, N.Y.: McGraw-Hill Education, 2001.

Cita MLA (8a ed.)

Lau, John H., y S. W. Ricky Lee. Microvias: For Low-cost, High-density Interconnects. First edition. McGraw-Hill Education, 2001.