Fundamentals of microsystems packaging /

"A rigorous and thorough introduction to electronic packaging technologies. Each chapter covers a single major packaging technology illustrated with schematics and diagrams. Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapter.".

Détails bibliographiques
Cote:Libro Electrónico
Autres auteurs: Tummala, Rao R., 1942-, Morris, James E., Davidson, Evan, Sarma, D. H. R., Hubbard, Bob, Rao, N. J., Swaminathan, Madhavan, Peterson, Andrew F., Kim, Juongho, Sitaraman, Suresh K., Pang, John H. L., Bar-Cohen, Avram, Watwe, Abhay, Seetharamu, Kankanhally N., Kamath, Sundar M., Charles, Harry K., Baldwin, David F., Garrou, Phil, Prymak, John, Bhattacharya, Swapan, Paik, Kyung, Cruz Rivera, Jose L., Gaylord, Thomas K., Glytsis, Elias N., Laskar, Joy, Tentzeris, Emmanouil M., Schutt-Aine, Jose E., Ramesham, Rajeshuni, Ghaffarian, Reza, Ayazi, Farrokh, Wong, C. P., Fang, Treliant, Varadarajan, Mahesh, Illyefalvi-Vitez, Zsolt, ZImmermann, Joachim, Mattsson, Fredrik, Kandelid, Stefan, Raj, Pulugurtha Markondeya, Liu, Johan, Ohlckers, Per, Keezer, David, Kim, Bruce, Koppolu, Sasidhar, May, Gary S., Shinotani, Ken-ichi, Malmodin, Jens, Trankell, Richard, Qu, Jianmin, Guo, Yifan
Format: Électronique eBook
Langue:Inglés
Publié: New York, N.Y. : McGraw-Hill Education, [2001]
Édition:First edition.
Collection:McGraw-Hill's AccessEngineering.
Sujets:
Electronic packaging.
Microelectronic packaging.
Miniature electronic equipment > Packaging.
Electronic packaging > Design.
Electronic apparatus and appliances > Temperature control.
Chip scale packaging.
Multichip modules (Microelectonics)
Integrated circuits.
Integrated circuits industry.
Passive components.
Integrated passive components.
Optoelectronics.
Radio frequency integrated circuits.
Microelectromechanical systems.
Sealing (Technology)
Miniature electronic equipment (Bonding)
Electronic apparatus and appliances > Plastic embedment.
Electronics > Materials > Surfaces.
Semiconductors > Surfaces.
Printed circuits > Design and construction.
Surface mount technology.
Electronic packaging > Materials.
Microelectronic packaging > Materials.
Electronics > Testing.
Microelectronics > Testing.
Microelectronics > Design.
Electronic apparatus and appliances > Reliability.
Electronic books.
Accès en ligne:Texto completo
Table des matières:
  • Introduction to microsystems packaging
  • Role of packaging in microelectronics
  • Role of packaging in microsystems
  • Fundamentals of electrical package design
  • Fundamentals of design for reliability
  • Fundamentals of thermal management
  • Fundamentals of single chip packaging
  • Fundamentals of multichip packaging
  • Fundamentals of IC assembly
  • Fundamentals of wafer-level packaging
  • Fundamentals of passives: discrete, integrated, and embedded
  • Fundamentals of optoelectronics
  • Fundamentals of RF packaging
  • Fundamentals of microelectromechanical systems
  • Fundamentals of sealing and encapsulation
  • Fundamentals of system-level PWB technologies
  • Fundamentals of board assembly
  • Fundamentals of packaging materials and processes
  • Fundamentals of electrical testing
  • Fundamentals of packaging manufacturing
  • Fundamentals of microsystems design for environment
  • Fundamentals of microsystems reliability.

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