Skip to content

UAM Iztapalapa 50 años

Login
  • 0 items (Full)
  • Servicios para Alumnos
  • Servicios para Académicos
  • Recupera tu NIP
  • Mis Préstamos y Multas
  • Language
    • Inglés
    • Español
    • Francés
    • Galego
bannerbg
Advanced
  • Electronic materials and proce...
  • Cite this
  • Text this
  • Email this
  • Print
  • Export Record
    • Export to RefWorks
    • Export to EndNoteWeb
    • Export to EndNote
  • Add to Book Bag Remove from Book Bag
  • Permanent link
Loading…
Preview
Preview
Preview

Electronic materials and processes handbook

Bibliographic Details
Call Number:Libro Electrónico
Other Authors: Harper, Charles A., Cohn, Charles, Schoch, Karl F., Bailey, Alan E., Gardner, J. Donald, Hwang, Jennie S., McChesney, Mike, Carano, Michael, Fjelstad, Joseph, Sergent, Jerry E., Toleno, Brian J., Burns, Barry, Marinelli, Christy, Krum, Al
Format: Electronic eBook
Language:Inglés
Published: New York : McGraw-Hill, [2003]
Edition:3rd ed.
Series:McGraw-Hill's AccessEngineering.
Subjects:
Electronics > Materials.
Electronic apparatus and appliances > Materials.
Integrated circuits > Design and construction.
Microelectronics.
Integrated circuits > Materials.
Electronic ceramics.
Electronic packaging.
Microelectronic packaging.
Printed circuits.
Electric insulators and insulation > Plastics.
Adhesives.
Solder and soldering.
Electronic apparatus and appliances > Temperature control.
Electronic books.
Internet resources.
Online Access:Texto completo
  • Holdings
  • Description
  • Table of Contents
  • Similar Items
  • Staff View
Table of Contents:
  • http://www.loc.gov/catdir/toc/mh031/2003046353.html

Similar Items

  • Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials /
    Published: (2003)
  • Area array packaging handbook /
    by: Gilleo, Ken
    Published: (2002)
  • Fundamentals of microsystems packaging /
    Published: (2001)
  • Reflow soldering processes : SMT, BGA, CSP and flip chip technologies /
    by: Lee, Ning-Cheng
    Published: (2002)
  • Reflow soldering processes : SMT, BGA, CSP and flip chip technologies /
    by: Lee, Ning-Cheng
    Published: (2002)

Coordinación de Servicios Documentales

  • Av. Ferrocarril San Rafael Atlixco, Núm. 186, Col. Leyes de Reforma 1 A Sección, Alcaldía Iztapalapa, C.P. 09310, Ciudad de México.
  • ¿Tienes alguna duda?, por favor envíala al correo eléctronico: bibl@xanum.uam.mx

Horario de servicio

  • Lunes a viernes: 8:00 hrs a 21:45 hrs

Opciones de búsqueda

  • Search History
  • Catálogo Anterior

¿Necesitas ayuda?

  • Search Tips
  • Ask a Librarian
  • FAQs

Copyright © 2023 Coordinación de Servicios Documentales. Todos los derechos reservados.

Cannot write session to /tmp/vufind_sessions/sess_tuqd6cd2us8n2ihq5su9r7r7b1