Area array packaging handbook /

"Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC). Details the pros and cons of each technology with varying applications. Examines packaging ramifications of hi...

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Détails bibliographiques
Cote:Libro Electrónico
Auteur principal: Gilleo, Ken (Auteur)
Collectivité auteur: Prismark Partners LLC
Autres auteurs: Lasky, Ronald. C., Morvan, Y., Smith, Lee, Fjelstad, Joseph, Yasumura, Gary, Kim, Young Gon, Randolph, Steve, Sanders, John, Cole, Marie S., Bates, Bill, Chen, Tim, Cotterman, Bruce, Garrett, Dave, Mohanty, Rita, Perry, John, Preveti, Mike, Lee, Jacob, Minogue, Gerard, Hwang, Jennie S., Rae, Alan, Blumel, David, Baldwin, Daniel F., Johnson, R. Wayne, Wood, Paul, Rupprecht, Howard, Ghaffarian, Raza, Lazinsky, C., Belmonte, Joe, Schiebel, Gunter, Apell, Marc, McLenaghan, A. James, Lewis, Brian, Jiang, Nan, Travers, Joseph, Anderson, Steve, Zarrow, Phil
Format: Électronique eBook
Langue:Inglés
Publié: New York, N.Y. : McGraw-Hill Education, [2002]
Édition:First edition.
Collection:McGraw-Hill's AccessEngineering.
Sujets:
Ball grid array technology.
Microelectronic packaging.
Electronics industries.
Electronic packaging.
Integrated circuits industry.
Flip chip technology.
Polymers.
Electronics > Materials.
Hermetic sealing.
Adhesives.
Solder and soldering.
Multichip modules (Microelectronics) > Testing.
Screen process printing.
Software measurement.
Electronic apparatus and appliances > Costs.
Surface mount technology.
Electronic books.
Accès en ligne:Texto completo

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