Area array packaging handbook /
"Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC). Details the pros and cons of each technology with varying applications. Examines packaging ramifications of hi...
Cote: | Libro Electrónico |
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Auteur principal: | |
Collectivité auteur: | |
Autres auteurs: | , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , |
Format: | Électronique eBook |
Langue: | Inglés |
Publié: |
New York, N.Y. :
McGraw-Hill Education,
[2002]
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Édition: | First edition. |
Collection: | McGraw-Hill's AccessEngineering.
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Sujets: | |
Accès en ligne: | Texto completo |