Thermal conductivity 33 : thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA /

Bibliographic Details
Call Number:Libro Electrónico
Corporate Authors: International Thermal Conductivity Conference Logan, Utah, International Thermal Expansion Symposium
Other Authors: Ban, Heng (Editor)
Format: Electronic Conference Proceeding eBook
Language:Inglés
Published: Lancaster, PA : DEStech Publications, 2018.
Subjects:
Heat > Conduction > Congresses.
Heat > Conduction > Measurement > Methodology > Congresses.
Materials > Thermal properties > Congresses.
Materials > Thermal properties > Measurement > Methodology > Congresses.
Expansion (Heat) > Congresses.
Expansion (Heat) > Measurement > Methodology > Congresses.
Chaleur > Conduction > Congrès.
Matériaux > Propriétés thermiques > Congrès.
Dilatation (Thermodynamique) > Congrès.
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