International Thermal Conductivity Conference Logan, Utah, International Thermal Expansion Symposium, & Ban, H. (2018). Thermal conductivity 33: Thermal expansion 21 : joint conferences, May 15-18, 2017, Logan, Utah, USA. DEStech Publications.
Style de citation Chicago (17e éd.)International Thermal Conductivity Conference Logan, Utah, International Thermal Expansion Symposium, et Heng Ban. Thermal Conductivity 33: Thermal Expansion 21 : Joint Conferences, May 15-18, 2017, Logan, Utah, USA. Lancaster, PA: DEStech Publications, 2018.
Style de citation MLA (8e éd.)International Thermal Conductivity Conference Logan, Utah, et al. Thermal Conductivity 33: Thermal Expansion 21 : Joint Conferences, May 15-18, 2017, Logan, Utah, USA. DEStech Publications, 2018.
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