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Harsh environment electronics : interconnect materials and performance assessment /
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barrie...
| Clasificación: | Libro Electrónico |
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| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Weinheim, Germany :
Wiley-VCH Verlag GmbH & Co.,
[2019]
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| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Wide-Bandgap Semiconductor Device Technologies for High-Temperature and Harsh Environment Applications / Md Rafiqul Islam, Roisul H Galib, Montajar Sarkar, Shaestagir Chowdhury
- High-Temperature Lead-free Solder Materials and Applications / Mohd F M Sabri, Bakhtiar Ali, Suhana M Said
- Role of Alloying Addition in Zn-Based Pb-Free Solders / Khairul Islam, Ahmed Sharif
- Effect of Cooling Rate on the Microstructure, Mechanical Properties, and Creep Resistance of a Cast Zn-Al-Mg High-temperature Lead-Free Solder Alloy / Reza Mahmudi, Davood Farasheh, Seyyed S Biriaie
- Development of Zn-Al-x Ni Lead-Free Solders for High-Temperature Applications / Sanjoy Mallick, Md Sharear Kabir, Ahmed Sharif
- Study of Zn-Mg-Ag High-Temperature Solder Alloys / Roisul H Galib, Md Ashif Anwar, Ahmed Sharif
- Characterization of Zn-Mo and Zn-Cr Pb-Free Composite Solders as a Potential Replacement for Pb-Containing Solders / Khairul Islam, Ahmed Sharif
- Gold-Based Interconnect Systems for High-Temperature and Harsh Environments / Ayesha Akter, Ahmed Sharif, Rubayyat Mahbub
- Bi-Based Interconnect Systems and Applications / Manifa Noor, Ahmed Sharif
- Recent Advancement of Research in Silver-Based Solder Alloys / Ahmed Sharif
- Silver Nanoparticles as Interconnect Materials / Md Ashif Anwar, Roisul Hasan Galib, Ahmed Sharif
- Transient Liquid Phase Bonding / Tariq Islam, Ahmed Sharif
- All-Copper Interconnects for High-Temperature Applications / Ahmed Sharif
- Glass-Frit-Based Die-Attach Solution for Harsh Environments / Ahmed Sharif
- Carbon-Nanotube-Reinforced Solders as Thermal Interface Materials / Md Muktadir Billah
- Reliability Study of Solder Joints in Electronic Packaging Technology / Ahmed Sharif, Sushmita Majumder.