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Advances in chemical mechanical planarization (CMP) /
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planar...
| Call Number: | Libro Electrónico |
|---|---|
| Other Authors: | |
| Format: | Electronic eBook |
| Language: | Inglés |
| Published: |
Waltham, MA :
Woodhead Publishing,
[2016]
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| Series: | Woodhead Publishing series in electronic and optical materials ;
no. 86. |
| Subjects: | |
| Online Access: | Texto completo |