Cita APA (7a ed.)

Wong, E., & Mai, Y. W. (2015). Robust design of microelectronics assemblies against mechanical shock, temperature and moisture. Woodhead Publishing.

Cita Chicago Style (17a ed.)

Wong, E.-H, y Y. W. Mai. Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture. Cambridge, UK: Woodhead Publishing, 2015.

Cita MLA (8a ed.)

Wong, E.-H, y Y. W. Mai. Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture. Woodhead Publishing, 2015.