Datacom equipment power trends and cooling applications.

"Gives data center facility designers and manufacturers a clear understanding of their facilities' design needs and allows them to accurately predict the equipment loads their facilities will need to accommodate. Also includes air and liquid cooling options that may be considered"--

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: American Society of Heating, Refrigerating and Air-Conditioning Engineers
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Atlanta, GA : American Society of Heating, Refrigerating, and Air-Conditioning Engineers, 2012.
Edición:2nd ed.
Colección:ASHRAE datacom series ; bk. 2.
Temas:
Electronic apparatus and appliances > Cooling.
Telecommunication > Equipment and supplies > Cooling.
Air conditioning > Design and construction.
Electronic data processing departments > Design and construction.
Appareils électroniques > Refroidissement.
TECHNOLOGY & ENGINEERING > Construction > Heating, Ventilation & Air Conditioning.
Air conditioning > Design and construction
Electronic apparatus and appliances > Cooling
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Machine generated contents note: 1. Introduction
  • 1.1. Purpose/Objective
  • 2. Background
  • 2.1. Datacom Facility Planning
  • 2.2. Simple Example of Datacom Equipment Growth Impact on a Facility
  • 2.3. Overview of Power Density Definitions
  • 2.4. IT and Facility Industry Collaboration
  • 2.5. IT Industry Background
  • 3.Component Power Trends
  • 3.1. Introduction
  • 3.2. Servers and Their Components
  • 3.3. Server Power Distribution
  • 3.4.Component Power Trends
  • 3.5. Power Supplies
  • 4. Load Trends and Their Application
  • 4.1. Introduction
  • ASHRAE Updated and Expanded Air-Cooling Power Trends
  • 4.2. Definition of Watts per Equipment Square Foot Metric
  • 4.3. The 2005 ASHRAE Power Trend Chart
  • 4.4. Power Trend Chart Evolution
  • 4.5. Volume Servers
  • 4.6. Idle Power For Servers
  • 4.7. ASHRAE Liquid-Cooling Power Trends
  • 4.8. Product Cycle vs. Building Life Cycle
  • 4.9. Predicting Future Loads
  • 4.10. Provisioning for Future Loads
  • 5. Air Cooling of Computer Equipment
  • Note continued: 5.1. Introduction
  • 5.2. Air Cooling Overview
  • 5.3. Underfloor Distribution
  • 5.4. Overhead Distribution
  • 5.5. Managing Supply and Return Airflows
  • 5.6. Local Distribution
  • 5.7. Air-Cooling Equipment
  • 5.8. Air-Cooling Controls
  • 5.9. Reliability
  • 6. Liquid Cooling of Computer Equipment
  • 6.1. Introduction
  • 6.2. Liquid Cooling Overview
  • 6.3. Liquid-Cooled Computer Equipment
  • 6.4. Liquid Coolants for Computer Equipment
  • 6.5. Datacom Facility Chilled-Water System
  • 6.6. Reliability
  • 7. Practical Example of Trends to Data Center Design
  • 7.1. Introduction
  • Introduction to Appendices
  • Appendix A Glossary
  • Appendix B Additional Power Trend Chart Information/Data
  • Appendix C Electronics, Semiconductors, Microprocessors, ITRS
  • C.1. Cost-Performance Processors
  • C.2. High-Performance Processors
  • C.3. Post CMOS.

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