Adhesives technology for electronic applications : materials, processing, reliability /

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This text presents a comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, it includes new developments in anisotropic, electrically conductive, and underfill adhesives.

Détails bibliographiques
Cote:Libro Electrónico
Auteur principal: Licari, James J., 1930-
Autres auteurs: Swanson, Dale W.
Format: Électronique eBook
Langue:Inglés
Publié: Amsterdam ; Boston : William Andrew Pub., 2011.
Édition:2nd ed.
Collection:Materials and processes for electronic applications series.
Sujets:
Electronics > Materials.
Adhesives.
Electronic packaging.
Adhesives
Électronique > Matériaux.
Adhésifs.
Mise sous boîtier (Électronique)
adhesive.
Electronic packaging
Electronics > Materials
Accès en ligne:Texto completo
Table des matières:
  • Machine generated contents note: 1.Introduction
  • 2.Functions and theory of adhesives
  • 3.Chemistry, Formulation, and Properties of Adhesives
  • 4.Adhesive Bonding Processes
  • 5.Applications
  • 6.Reliability
  • 7.Test and Inspection Methods.

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