|
|
|
|
| LEADER |
00000cam a2200000 i 4500 |
| 001 |
EBSCO_on1128706105 |
| 003 |
OCoLC |
| 005 |
20231017213018.0 |
| 006 |
m o d |
| 007 |
cr cnu---unuuu |
| 008 |
191214t20192019ohua obf 001 0 eng d |
| 040 |
|
|
|a EBLCP
|b eng
|e rda
|e pn
|c EBLCP
|d YDXIT
|d OCLCO
|d YDX
|d N$T
|d OCLCF
|d OCLCQ
|d OSU
|d SFB
|d MM9
|d OCLCQ
|d CUV
|d OCLCO
|
| 019 |
|
|
|a 1128199507
|a 1132286236
|a 1144338218
|
| 020 |
|
|
|a 9781627082471
|q (electronic book)
|
| 020 |
|
|
|a 1627082476
|q (electronic book)
|
| 020 |
|
|
|a 9781627082464
|q (electronic bk.)
|
| 020 |
|
|
|a 1627082468
|q (electronic bk.)
|
| 020 |
|
|
|a 9781523126323
|q (electronic bk.)
|
| 020 |
|
|
|a 1523126329
|q (electronic bk.)
|
| 020 |
|
|
|z 9781627082457
|q (print)
|
| 020 |
|
|
|z 162708245X
|q (print)
|
| 029 |
1 |
|
|a AU@
|b 000066470982
|
| 029 |
1 |
|
|a AU@
|b 000068480145
|
| 035 |
|
|
|a (OCoLC)1128706105
|z (OCoLC)1128199507
|z (OCoLC)1132286236
|z (OCoLC)1144338218
|
| 050 |
|
4 |
|a TK7871
|b .M52 2019
|
| 082 |
0 |
4 |
|a 621.381
|2 23
|
| 049 |
|
|
|a UAMI
|
| 245 |
0 |
0 |
|a Microelectronics failure analysis :
|b desk reference /
|c edited by Tejinder Gandhi.
|
| 250 |
|
|
|a Seventh edition.
|
| 264 |
|
1 |
|a Materials Park, Ohio :
|b ASM International,
|c [2019]
|
| 264 |
|
4 |
|c ©2019
|
| 300 |
|
|
|a 1 online resource (xi, 705 pages) :
|b illustrations (some color)
|
| 336 |
|
|
|a text
|b txt
|2 rdacontent
|
| 337 |
|
|
|a computer
|b c
|2 rdamedia
|
| 338 |
|
|
|a online resource
|b cr
|2 rdacarrier
|
| 500 |
|
|
|a "An ASM materials solutions publication."
|
| 500 |
|
|
|a "EDFAS, Electronic Device Failure Analysis Society, ASM International."
|
| 504 |
|
|
|a Includes bibliographical references and indexes.
|
| 505 |
0 |
|
|a Intro; 01_Overview of Wafer-level Electrical Failure_Pai inputs_addressed; 03_EDFAS Desk Reference Paper -- Susan Li -- 8-5-2019 -- Final; 04_Non-destructive Techniques for Advanced Board Level Failure Analysis; 05_EDFAS Desk Refrence -- FA Lab management article-final; 06_07A Optical Microscopy for Desk Reference 2010_corrected; 07_X-ray imaging tools for electronic device failure analysis_CSFinal_V4; 08_!PUB-2019_EDFAS_SAM_Update_Final-20190731; Acoustic Microscopy of Semiconductor Packages; Cheryl D. Hartfield; Carl Zeiss SMT Inc., Pleasanton, CA, USA; cheryl.hartfield@zeiss.com
|
| 505 |
8 |
|
|a Thomas M. MooreWaviks Inc., Dallas, TX, USA; tom.moore@waviks.com; Sebastian Brand; Fraunhofer IMWS, Halle, Germany; sebastian.brand@imws.fraunhofer.de; Introduction; History; The C-scan; The Stanford SAM; Today's SAM for IC Package Inspection; Early SAM Applications in the IC Industry; An Important Tool for Popcorn Crack Detection; Theoretical Considerations; Overview: Acoustic Microscopy for IC Package Inspection; Types of Reflected Signal Analysis Modes:; Polarity Analysis of Reflected Signals; Time of Flight Imaging Using Reflected Signals; Resolution and Sensitivity of SAM Inspection
|
| 505 |
8 |
|
|a Transducer SelectionContrast mechanisms in acoustic imaging; Focusing of acoustic waves; Practical Applications of Conventional SAM; Plastic Package Inspection; Inspection of Packages Having High Velocity Substrates; Strategies for Inspection of Packages Having Thin Layers; Imaging Flip Chip Devices; Complementary Nondestructive Techniques; Current Challenges and New Developments; Stacked Die Packages and Increasing 3D Structures; Signal Analysis in Acoustic Microscopy for Enhanced Defect Detection Capabilities; Spectral Analysis and Split-Spectrum Imaging (SSP); Automated Bump Inspection
|
| 505 |
8 |
|
|a Crack Detection by Multimode and Shear-Wave ImagingExtending Package Inspection Capability with Acoustic Ghz-Microscopy: Potential, Application and Challenges; GHz-SAM Imaging of Wirebond Interfaces and Bond Pads; GHz-SAM for the Inspection of Bonding Interfaces in Wafer Bonding; GHz-SAM Inspection for Void Formation in Metallization Lines for Automotive Applications; Inspection of TSVs Using Acoustic GHz-Microscopy; Photo-acoustic GHz-microscopy: an emerging technique?; Summary; Author Contributions; References; 09_04C Srikanth_Keim_Eide__Diagnosis; 010_aorozco-edfas-deskref-7th-ed-v16
|
| 505 |
8 |
|
|a 011_TDR_EOTPR_TDT_desk_reference_ASM_r4012_Frontsidefinal_9-3-2019; 013_Backside Preparation and Optics Revision4; 014_Corrected Photon emission article (1); 015_Beam fault isolation corrected; 016_Desk Ref_7thEdition_ Thermal detection_V7_new title_rev1; 017_Desk Ref_7thEdition_3DLIT_V6.1; 018_LADA_SDL_Desk_Reference_Final_Final; 019_Laser Voltage Probing Article -; 020_EDFAS_CAD_Navigation_Principles_7th-Ed; 021_05C MDR_Rosenkranz; 022_EDFAS. Transistor Characterization(Final)_8_30; 023_Fundamentals_Nanoprobe_Final; 024_Silicon Device
|
| 588 |
0 |
|
|a Print version record.
|
| 590 |
|
|
|a eBooks on EBSCOhost
|b EBSCO eBook Subscription Academic Collection - Worldwide
|
| 650 |
|
0 |
|a Electronics
|x Materials
|x Testing
|v Handbooks, manuals, etc.
|
| 650 |
|
0 |
|a Microelectronics
|x Materials
|x Testing
|v Handbooks, manuals, etc.
|
| 650 |
|
0 |
|a Microelectronics
|x Materials
|x Defects
|v Handbooks, manuals, etc.
|
| 650 |
|
0 |
|a Electronic apparatus and appliances
|x Testing
|v Handbooks, manuals, etc.
|
| 650 |
|
0 |
|a Semiconductors
|x Defects
|v Handbooks, manuals, etc.
|
| 650 |
|
6 |
|a Microélectronique
|x Défauts
|v Guides, manuels, etc.
|
| 650 |
|
6 |
|a Appareils électroniques
|x Essais
|v Guides, manuels, etc.
|
| 650 |
|
6 |
|a Semi-conducteurs
|x Défauts
|v Guides, manuels, etc.
|
| 650 |
|
7 |
|a Electronic apparatus and appliances
|x Testing.
|2 fast
|0 (OCoLC)fst00906837
|
| 650 |
|
7 |
|a Electronics
|x Materials
|x Testing.
|2 fast
|0 (OCoLC)fst00907571
|
| 650 |
|
7 |
|a Microelectronics
|x Materials
|x Defects.
|2 fast
|0 (OCoLC)fst01019772
|
| 650 |
|
7 |
|a Microelectronics
|x Materials
|x Testing.
|2 fast
|0 (OCoLC)fst01019774
|
| 650 |
|
7 |
|a Semiconductors
|x Defects.
|2 fast
|0 (OCoLC)fst01112211
|
| 655 |
|
7 |
|a Handbooks and manuals.
|2 fast
|0 (OCoLC)fst01423877
|
| 655 |
|
7 |
|a Handbooks and manuals.
|2 lcgft
|
| 655 |
|
7 |
|a Guides et manuels.
|2 rvmgf
|
| 700 |
1 |
|
|a Gandhi, Tejinder,
|e editor.
|
| 710 |
2 |
|
|a ASM International,
|e issuing body.
|
| 710 |
2 |
|
|a Electronic Device Failure Analysis Society,
|e contributor.
|
| 776 |
0 |
8 |
|i Print version:
|t Microelectronics failure analysis.
|b Seventh edition.
|d Materials Park, Ohio : ASM International, 2019
|z 9781627082457
|w (DLC) 2019951107
|w (OCoLC)1126332918
|
| 856 |
4 |
0 |
|u https://ebsco.uam.elogim.com/login.aspx?direct=true&scope=site&db=nlebk&AN=2298608
|z Texto completo
|
| 938 |
|
|
|a EBSCOhost
|b EBSC
|n 2298608
|
| 938 |
|
|
|a YBP Library Services
|b YANK
|n 16549536
|
| 938 |
|
|
|a YBP Library Services
|b YANK
|n 300956305
|
| 994 |
|
|
|a 92
|b IZTAP
|
