Solutions to Problems in Heat Transfer : Transient Conduction or Unsteady Conduction /

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Elmardi, Osama Mohammed (Autor)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Hamburg : Diplomica Verlag, 2017.
Temas:
Heat > Transmission.
Chaleur > Transmission.
heat transmission.
TECHNOLOGY & ENGINEERING > Engineering (General)
TECHNOLOGY & ENGINEERING > Reference.
TECHNOLOGY & ENGINEERING > Mechanical.
Heat > Transmission
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Solutions to Problems in Heat Transfer. Transient Conduction or Unsteady Conduction
  • Dedication
  • Acknowledgement
  • Preface
  • Contents
  • Chapter One: Introduction
  • 1.1 General Introduction
  • 1.2 Definition of Lumped Capacity or Capacitance System
  • 1.3 Characteristic Linear Dimensions of Different Geometries
  • 1.4 Derivation of Equations of Lumped Capacitance System
  • 1.5 Solved Examples
  • Chapter Two: Time Constant and Response of Temperature MeasuringInstruments
  • 2.1 Introduction
  • 2.2 Solved Examples
  • Chapter Three: Transient Heat Conduction in Solids with Finite Conduction and Convective Resistances
  • 3.1 Introduction
  • 3.2 Solved Examples
  • Chapter Four: Transient Heat conduction in semi
  • infinite solids
  • 4.1 Introduction
  • 4.2 Penetration Depth and Penetration Time
  • 4.3 Solved Examples
  • Chapter Five: Systems with Periodic Variation of Surface Temperature
  • 5.1 Introduction
  • 5.2 Solved Examples
  • Chapter Six: Transient Conduction with Given Temperature Distribution
  • 6.1 Introduction
  • 6.2 Solved Examples
  • Chapter Seven: Additional Solved Examples in Lumped Capacitance System
  • 7.1 Example (1): Determination of Temperature and Rate of Coolingof a Steel Ball
  • 7.2 Example (2): Calculation of the Time Required to Cool a Thin Copper Plate
  • 7.3 Example (3): Determining the Conditions under which the Contact Surface Remains at Constant Temperature
  • 7.4 Example (4): Calculation of the Time Required for the Plate to Reach a Given Temperature
  • 7.5 Example (5): Determination of the Time Required for the Plate to Reach a Given Temperature
  • 7.6 Example (6): Determining the Temperature of a Solid Copper Sphere at a Given Time after the Immersion in a Well
  • Stirred Fluid
  • 7.7 Example (7): Determination of the Heat Transfer Coefficient
  • 7.8 Example (8): Determination of the Heat Transfer Coefficient.
  • 7.9 Example (9): Calculation of the Initial Rate of Cooling of a Steel Ball
  • 7.10 Example (10): Determination of the Maximum Speed of a Cylindrical Ingot inside a Furnace
  • 7.11 Example (11): Determining the Time Required to Cool a Mild Steel Sphere, the Instantaneous Heat Transfer Rate, and the Total Energy Transfer
  • 7.12 Example (12): Estimation of the Time Required to Cool a Decorative Plastic Film on Copper Sphere to a Given Temperature using Lumped Capacitance Theory
  • 7.13 Example (13): Calculation of the Time Taken to Boil an Egg
  • 7.14 Example (14): Determining the Total Time Required for a Cylindrical Ingot to be heated to a Given Temperature
  • Chapter Eight: Unsolved Theoretical Questions and Further Problems in Lumped Capacitance System
  • 8.1 Theoretical Questions
  • 8.2 Further Problems
  • References
  • Appendix
  • About the Author.

Ejemplares similares