Cita APA (7a ed.)

International Congress Molded Interconnect Devices Nuremberg, Germany, and Fuerth, Germany, & Franke, J. (2014). 11th international congress molded interconnect devices: Scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. TTP.

Cita Chicago Style (17a ed.)

International Congress Molded Interconnect Devices Nuremberg, Germany, and Fuerth, Germany, y Jörg Franke. 11th International Congress Molded Interconnect Devices: Scientific Proceedings : Selected, Peer Reviewed Papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. Pfaffikon, Switzerland: TTP, 2014.

Cita MLA (8a ed.)

International Congress Molded Interconnect Devices Nuremberg, Germany, and Fuerth, Germany, y Jörg Franke. 11th International Congress Molded Interconnect Devices: Scientific Proceedings : Selected, Peer Reviewed Papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. TTP, 2014.

Precaución: Estas citas no son 100% exactas.