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Integrated interconnect technologies for 3D nanoelectronic systems /

This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source.

Détails bibliographiques
Cote:Libro Electrónico
Autres auteurs: Bakir, Muhannad S., Meindl, James D., 1933-2020
Format: Électronique eBook
Langue:Inglés
Publié: Boston, Mass. ; London : Artech House, ©2009.
Collection:Artech House integrated microsystems series.
Sujets:
Accès en ligne:Texto completo