Bakir, M. S., & Meindl, J. D. (2009). Integrated interconnect technologies for 3D nanoelectronic systems. Artech House.
Cita Chicago Style (17a ed.)Bakir, Muhannad S., y James D. Meindl. Integrated Interconnect Technologies for 3D Nanoelectronic Systems. Boston, Mass. ; London: Artech House, 2009.
Cita MLA (8a ed.)Bakir, Muhannad S., y James D. Meindl. Integrated Interconnect Technologies for 3D Nanoelectronic Systems. Artech House, 2009.
Precaución: Estas citas no son 100% exactas.