Microelectronics failure analysis : desk reference /

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Bibliographic Details
Call Number:Libro Electrónico
Corporate Authors: Electronic Device Failure Analysis Society. Desk Reference Committee, ASM International
Format: Electronic eBook
Language:Inglés
Published: Materials Park, Ohio : ASM International, ©2004.
Subjects:
Microelectronics > Materials > Testing > Handbooks, manuals, etc.
Microelectronics > Defects > Testing > Handbooks, manuals, etc.
Electronic apparatus and appliances > Testing > Handbooks, manuals, etc.
Electronics > Materials > Testing > Handbooks, manuals, etc.
Electronics > Materials > Defects > Handbooks, manuals, etc.
Electronics > Materials > Handbooks, manuals, etc.
Appareils électroniques > Essais > Guides, manuels, etc.
Électronique > Matériaux > Guides, manuels, etc.
TECHNOLOGY & ENGINEERING > Electronics > Circuits > General.
TECHNOLOGY & ENGINEERING > Electronics > Circuits > Integrated.
Electronic apparatus and appliances > Testing
Electronics > Materials > Defects
Electronics > Materials > Testing
Microelectronics > Materials > Testing
handbooks.
Handbooks and manuals
Handbooks and manuals.
Guides et manuels.
Online Access:Texto completo
Table of Contents:
  • Introduction
  • Failure analysis process flow
  • Failure verification
  • Failure mode: failure classifications
  • Special devices
  • Non-destructive analysis techniques
  • Depackaging
  • Photon emission (electroluminescence) localization techniques
  • Microthermography
  • Laser and particle beam-based localization techniques
  • Deprocessing
  • General imaging techniques
  • Local deprocessing and imaging
  • Materials analysis techniques
  • Important topics for semiconductor devices
  • FA techniques/tools roadmaps
  • FA operation and management
  • Appendix.

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