Tabla de Contenidos:
  • Introduction
  • Failure analysis process flow
  • Failure verification
  • Failure mode: failure classifications
  • Special devices
  • Non-destructive analysis techniques
  • Depackaging
  • Photon emission (electroluminescence) localization techniques
  • Microthermography
  • Laser and particle beam-based localization techniques
  • Deprocessing
  • General imaging techniques
  • Local deprocessing and imaging
  • Materials analysis techniques
  • Important topics for semiconductor devices
  • FA techniques/tools roadmaps
  • FA operation and management
  • Appendix.