Materials for high-density electronic packaging and interconnection.

Bibliographic Details
Call Number:Libro Electrónico
Corporate Author: National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging
Format: Electronic eBook
Language:Inglés
Published: Washington, D.C. : National Academy Press, 1990.
Subjects:
Electronic packaging > Materials.
Mise sous boîtier (Électronique) > Matériaux.
TECHNOLOGY & ENGINEERING > Electronics > Microelectronics.
TECHNOLOGY & ENGINEERING > Electronics > Digital.
Electronic packaging > Materials
Online Access:Texto completo

Similar Items

Similar Items