Imaps 2018
Call Number: | Libro Electrónico |
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Main Author: | |
Other Authors: | |
Format: | Electronic eBook |
Language: | Inglés |
Published: |
Bradford, West Yorkshire :
Emerald Publishing Limited,
2019.
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Series: | Circuit World Ser.
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Subjects: | |
Online Access: | Texto completo |
Table of Contents:
- Cover; Guest editorial; Joints realized by sintering of pressureless Ag paste; Photonic curing of silver paths on 3D printed polymer substrate; Investigation of inkjet printed path resistance in the context of manufacture and flexible application; Electrical and rheological percolation threshold of graphene pastes for screen-printing; Piezoresistive effect in embedded thick-film resistors; Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs; Signal integrity in microelectronic hybrid systems made on metal substrates