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Imaps 2018

Bibliographic Details
Call Number:Libro Electrónico
Main Author: Pecht, Michael
Other Authors: Skwarek, Agata
Format: Electronic eBook
Language:Inglés
Published: Bradford, West Yorkshire : Emerald Publishing Limited, 2019.
Series:Circuit World Ser.
Subjects:
Online Access:Texto completo
Table of Contents:
  • Cover; Guest editorial; Joints realized by sintering of pressureless Ag paste; Photonic curing of silver paths on 3D printed polymer substrate; Investigation of inkjet printed path resistance in the context of manufacture and flexible application; Electrical and rheological percolation threshold of graphene pastes for screen-printing; Piezoresistive effect in embedded thick-film resistors; Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs; Signal integrity in microelectronic hybrid systems made on metal substrates