Robust design of microelectronics assemblies against mechanical shock, temperature and moisture /

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This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. De...

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Bibliographic Details
Call Number:Libro Electrónico
Main Authors: Wong, E. -H. (Ee-Hua) (Author), Mai, Y. W., 1946- (Author)
Format: Electronic eBook
Language:Inglés
Published: Cambridge, UK : Woodhead Publishing, [2015]
Series:Woodhead Publishing series in electronic and optical materials ; no. 81.
Subjects:
Computer engineering.
Microelectronics > Design.
Ordinateurs > Conception et construction.
TECHNOLOGY & ENGINEERING > Mechanical.
TECHNOLOGY & ENGINEERING > Electronics > Microelectronics.
Computer engineering
Microelectronics > Design
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