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Adhesion in microelectronics /
In a single and easily accessible source, this comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics. --
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Hoboken, New Jersey :
John Wiley and Sons, Inc.,
[2014]
|
| Colección: | Adhesion and adhesives. Fundamental and applied aspects.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
| LEADER | 00000cam a2200000 i 4500 | ||
|---|---|---|---|
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| 049 | |a UAMI | ||
| 245 | 0 | 0 | |a Adhesion in microelectronics / |c edited by K.L. Mittal and Tanweer Ahsan. |
| 264 | 1 | |a Hoboken, New Jersey : |b John Wiley and Sons, Inc., |c [2014] | |
| 264 | 4 | |c ©2014 | |
| 300 | |a 1 online resource | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Adhesion and Adhesives: Fundamental and Applied Aspects | |
| 504 | |a Includes bibliographical references and index. | ||
| 588 | 0 | |a Print version record and CIP data provided by publisher. | |
| 520 | |a In a single and easily accessible source, this comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics. -- |c Edited summary from book. | ||
| 505 | 0 | |a Half Title page; Title page; Copyright page; Preface; Acknowledgements; Part 1: Adhesion: Fundamentals and Measurement; Chapter 1: Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy, with Special Reference to Microelectronics; 1.1 Introduction; 1.2 Principles of IETS; 1.3 Application of IETS in Microelectronics; 1.4 Prospects; 1.5 Summary; References; Chapter 2: Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics.; 2.1. Introduction; 2.2 Mechanical Methods; 2.3 Laser Based Techniques; 2.4 Summary and Remarks; References. | |
| 505 | 8 | |a Part 2: Ways to Promote/Enhance AdhesionChapter 3: Tailoring of Interface/Interphase to Promote Metal-Polymer Adhesion; 3.1 Introduction; 3.2 New Concepts for Ideal Design of Metal-Polymer Interfaces with Covalently Bonded Flexible Spacer Molecules; 3.3 Situation at Al Oxide/Hydroxide Surfaces Using Aluminium as Substrate; 3.4. Adhesion Promotion by Non-specific Functionalization of Polyolefin Surfaces; 3.5 Methods for Producing Monosort Functional Groups at Polyolefin Surfaces; 3.6 Reactions and Bond Formation at the Interface; 3.7 Grafting of Spacer Molecules at Polyolefin Surfaces. | |
| 505 | 8 | |a 3.8 Summary and ConclusionsAcknowledgement; References; Chapter 4: Atmospheric and Vacuum Plasma Treatments of Polymer Surfaces for Enhanced Adhesion in Microelectronics Packaging; 4.1 Introduction; 4.2 Plasma Fundamentals; 4.3 Survey of Vacuum Plasma Treatment of Polymers; 4.4 Survey of Atmospheric Pressure Plasma Treatment of Polymers; 4.5 Atmospheric Pressure Plasma Activation of Polymer Materials Relevant to Microelectronics; 4.6 Vacuum Versus Atmospheric Plasmas for Use in Semiconductor Packaging; References. | |
| 505 | 8 | |a Chapter 5: Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications5.1 Introduction; 5.2 ICA Technology; 5.3 Technology Reviews; 5.4 Electrical Properties; 5.5 Mechanical Properties; 5.6 Thermal Properties; 5.7 Metallic Filler; 5.8 Polymer Materials; 5.9 Reliability; 5.10 Dispensation; 5.11 Environmental Properties; 5.12 Other Results; 5.13 Summary; 5.14 Prospects; References; Part 3: Reliability and Failure Mechanisms; Chapter 6: Role of Adhesion Phenomenon in the Reliability of Electronic Packaging; 6.1 Introduction; 6.2 Hierarchy of Electronic Packaging. | |
| 505 | 8 | |a 6.3 Substrates, Carriers, and Laminates6.4 Flexible Laminates; 6.5 First Level Packaging /Semiconductor Packaging; 6.6 Second Level Packaging; 6.7 Reliability Enhancements; 6.8 Thermal Management; 6.9 Summary; Acknowledgements; References; Chapter 7: Delamination and Reliability Issues in Packaged Devices; 7.1 Introduction; 7.2 Basic Aspects of Delamination Failure; 7.3 Evaluation of Delamination Initiation in Electronic Packages; 7.4 Evaluation of Delamination Propagation in Electronic Packages; 7.5 Summary; References. | |
| 590 | |a ProQuest Ebook Central |b Ebook Central Academic Complete | ||
| 650 | 0 | |a Microelectronic packaging |x Materials. | |
| 650 | 0 | |a Adhesives. | |
| 650 | 0 | |a Adhesive joints. | |
| 650 | 6 | |a Mise sous boîtier (Microélectronique) |x Matériaux. | |
| 650 | 6 | |a Adhésifs. | |
| 650 | 6 | |a Assemblages collés. | |
| 650 | 7 | |a adhesive. |2 aat | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Mechanical. |2 bisacsh | |
| 650 | 7 | |a Adhesive joints |2 fast | |
| 650 | 7 | |a Adhesives |2 fast | |
| 650 | 7 | |a Microelectronic packaging |x Materials |2 fast | |
| 700 | 1 | |a Mittal, K. L., |d 1945- | |
| 700 | 1 | |a Ahsan, Tanweer. | |
| 758 | |i has work: |a Adhesion in microelectronics (Text) |1 https://id.oclc.org/worldcat/entity/E39PCGwcFvXpdwQWfVJFQxq6yq |4 https://id.oclc.org/worldcat/ontology/hasWork | ||
| 776 | 0 | 8 | |i Print version: |t Adhesion in microelectronics. |d Hoboken, New Jersey : John Wiley and Sons, Inc., [2014] |z 9781118831335 |w (DLC) 2014029765 |
| 830 | 0 | |a Adhesion and adhesives. |p Fundamental and applied aspects. | |
| 856 | 4 | 0 | |u https://ebookcentral.uam.elogim.com/lib/uam-ebooks/detail.action?docID=1767917 |z Texto completo |
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