Adhesion in microelectronics /

In a single and easily accessible source, this comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics. --

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Mittal, K. L., 1945-, Ahsan, Tanweer
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Hoboken, New Jersey : John Wiley and Sons, Inc., [2014]
Colección:Adhesion and adhesives. Fundamental and applied aspects.
Temas:
Microelectronic packaging > Materials.
Adhesives.
Adhesive joints.
Mise sous boîtier (Microélectronique) > Matériaux.
Adhésifs.
Assemblages collés.
adhesive.
TECHNOLOGY & ENGINEERING > Mechanical.
Adhesive joints
Adhesives
Microelectronic packaging > Materials
Acceso en línea:Texto completo
Descripción
Sumario:In a single and easily accessible source, this comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics. --
Descripción Física:1 online resource
Bibliografía:Includes bibliographical references and index.
ISBN:9781118831342
1118831349
9781118831359
1118831357
9781118831373
1118831373
1118831330
9781118831335

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