Handbook of 3D integration. Volume 3, 3D process technology /

Bibliographic Details
Call Number:Libro Electrónico
Other Authors: Garrou, Philip E. (Editor), Koyanagi, Mitsumasa (Editor), Ramm, Peter (Editor)
Format: Electronic eBook
Language:Inglés
Published: Weinheim : Wiley-VCH, [2014]
Edition:First edition.
Subjects:
Integrated circuits.
Integrated circuits > Design and construction.
Semiconductor wafers.
Three-dimensional imaging.
Imaging, Three-Dimensional
Circuits intégrés.
Circuits intégrés > Conception et construction.
Plaquettes à gravure en semi-conducteurs.
Imagerie tridimensionnelle.
three-dimensional.
TECHNOLOGY & ENGINEERING > Mechanical.
Integrated circuits
Integrated circuits > Design and construction
Semiconductor wafers
Three-dimensional imaging
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