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Advanced interconnects for ULSI technology /
"This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"--
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | , , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Hoboken, NJ :
Wiley,
2012.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 245 | 0 | 0 | |a Advanced interconnects for ULSI technology / |c [edited by] Mikhail Baklanov, Paul S. Ho, Ehrenfried Zschech. |
| 260 | |a Hoboken, NJ : |b Wiley, |c 2012. | ||
| 300 | |a 1 online resource | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
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| 520 | |a "This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"-- |c Provided by publisher | ||
| 504 | |a Includes bibliographical references and index. | ||
| 588 | 0 | |a Print version record. | |
| 505 | 0 | |a Front Matter -- Colour Plates -- Section I: Low-. Low- Materials: Recent Advances / Geraud Dubois, Willi Volksen -- Ultra-Low- by CVD: Deposition and Curing / Vincent Jousseaume, Aziz Zenasni, Olivier Gourhant, Laurent Favennec, Mikhail R Baklanov -- Plasma Processing of Low- Dielectrics / Hualiang Shi, Denis Shamiryan, Jean-Fraṅois de Marneffe, Huai Huang, Paul S Ho, Mikhail R Baklanov -- Wet Clean Applications in Porous Low- Patterning Processes / Quoc Toan Le, Guy Vereecke, Herbert Struyf, Els Kesters, Mikhail R Baklanov -- Section II: Conductive Layers and Barriers. Copper Electroplating for On-Chip Metallization / Valery M Dubin -- Diffusion Barriers / Michael Hecker, Rene Hubner -- Section III: Integration and Reliability. Process Integration of Interconnects / Sridhar Balakrishnan, Ruth Brain, Larry Zhao -- Chemical Mechanical Planarization for Cu₆Low- Integration / Gautam Banerjee -- Scaling and Microstructure Effects on Electromigration Reliability for Cu Interconnects / Chao-Kun Hu, Rene Hubner, Lijuan Zhang, Meike Hauschildt, Paul S Ho -- Mechanical Reliability of Low- Dielectrics / Kris Vanstreels, Han Li, Joost J Vlassak -- Electrical Breakdown in Advanced Interconnect Dielectrics / Ennis T Ogawa, Oliver Aubel -- Section IV: New Approaches. 3D Interconnect Technology / John U Knickerbocker, Lay Wai Kong, Sven Niese, Alain Diebold, Ehrenfried Zschech -- Carbon Nanotubes for Interconnects / Mizuhisa Nihei, Motonobu Sato, Akio Kawabata, Shintaro Sato, Yuji Awano -- Optical Interconnects / Wim Bogaerts -- Wireless Interchip Interconnects / Takamaro Kikkawa -- Index. | |
| 590 | |a ProQuest Ebook Central |b Ebook Central Academic Complete | ||
| 650 | 0 | |a Interconnects (Integrated circuit technology) | |
| 650 | 0 | |a Integrated circuits |x Ultra large scale integration. | |
| 650 | 6 | |a Interconnexions (Technologie des circuits intégrés) | |
| 650 | 6 | |a Circuits intégrés à ultra-grande échelle. | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Circuits |x VLSI & ULSI. |2 bisacsh | |
| 650 | 7 | |a COMPUTERS |x Logic Design. |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Circuits |x Logic. |2 bisacsh | |
| 650 | 7 | |a Integrated circuits |x Ultra large scale integration |2 fast | |
| 650 | 7 | |a Interconnects (Integrated circuit technology) |2 fast | |
| 700 | 1 | |a Baklanov, Mikhail. | |
| 700 | 1 | |a Ho, P. S. | |
| 700 | 1 | |a Zschech, Ehrenfried. | |
| 758 | |i has work: |a Advanced Interconnects for ULSI Technology [electronic resource] (Text) |1 https://id.oclc.org/worldcat/entity/E39PCYyYVWmjj3TYKfcWxdGXQy |4 https://id.oclc.org/worldcat/ontology/hasWork | ||
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| 776 | 0 | 8 | |i Print version: |t Advanced interconnects for ULSI technology. |d Hoboken, NJ : Wiley, 2012 |z 9780470662540 |w (DLC) 2011038787 |w (OCoLC)757478544 |
| 856 | 4 | 0 | |u https://ebookcentral.uam.elogim.com/lib/uam-ebooks/detail.action?docID=865036 |z Texto completo |
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